Tiger Linear Motor: Redefining the New Benchmark for Precision Motion Control with Technological Breakthroughs
Amid the wave of industrial automation upgrading toward "high precision, high integration, and high reliability", linear motors, as core executive components, are becoming the key to breaking foreign technological monopolies and realizing domestic substitution in critical fields. After years of R&D, we have launched the high-performance shaft-type linear motor. With the core advantages of "smaller size, higher precision, faster response, and longer service life", it provides localized precision motion solutions for semiconductors, precision manufacturing, and other fields, redefining the industry's technical standards.
1. "Dramatic" Reduction in Thrust Ripple
By combining the Halbach array with gradient permanent magnets, the traditional sinusoidal magnetic field is reconstructed into a segmented parabolic and polynomial curve. Under the 100Hz working condition, the thrust ripple is reduced from the industry's common 15% to only 2.8%, and the data distortion rate is simultaneously reduced to 2.8%. This completely solves the "vibration" problem during high-frequency operation and ensures stable sub-micron-level precision output in scenarios such as wafer inspection and die sorting.
2. "Multi-Fold" Improvement in Dynamic Response
Through optimizing the decoupling control of electromagnetic torque and reluctance torque, the dynamic response time is reduced from 50ms to 8ms, which is equivalent to more than a 5-fold improvement in the "response speed" of the equipment. This easily meets the "high-frequency start-stop" demand of semiconductor cleaning equipment. Combined with the high-speed operation capability of ≤4m/s, it achieves a qualitative leap in production line efficiency.
3. "Dual Breakthroughs" in Size and Performance
The innovative shaft-type structural design, compared with traditional flat-type and U-type linear motors, reduces the size by more than 30% while achieving a maximum continuous thrust of 3000N. It perfectly adapts to the demand for "compact structure and miniaturization of internal components" in semiconductor equipment, and can be directly embedded into the narrow space of die sorters without additional equipment structure modification, solving the industry pain point of "small size with the same mechanical performance".
